18397105. ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE

Organization Name

Samsung Display Co., LTD.

Inventor(s)

Jung Hoon Shin of Seongnam-si (KR)

Hyuk Hwan Kim of Suwon-si (KR)

Byoung Dae Ye of Yongin-si (KR)

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18397105 titled 'ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE

Simplified Explanation

The adhesive member described in the patent application consists of a conductive particle layer, a non-conductive layer, and a screening layer with spaced-apart screening members.

• Conductive particle layer: Contains multiple conductive particles.
• Non-conductive layer: Positioned on top of the conductive particle layer.
• Screening layer: Located between the conductive particle layer and the non-conductive layer, consisting of several screening members spaced apart from each other.

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1. 1. 1. Potential Applications of this Technology

The technology could be applied in:

• Electronics manufacturing
• Medical devices
• Aerospace industry

1. 1. 1. Problems Solved by this Technology

This technology helps in:

• Improving adhesion in electronic components
• Enhancing conductivity in devices
• Preventing short circuits

1. 1. 1. Benefits of this Technology

The benefits include:

• Increased efficiency in electronic devices
• Enhanced durability of adhesive bonds
• Improved performance of conductive materials

1. 1. 1. Potential Commercial Applications of this Technology

The technology could be utilized in:

• Conductive adhesives market
• Semiconductor industry
• Automotive electronics sector

1. 1. 1. Possible Prior Art

One possible prior art could be the use of conductive adhesives in electronics manufacturing to improve connectivity and adhesion.

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1. 1. 1. 1. Unanswered Questions

1. 1. 1. How does this technology compare to traditional adhesive methods?

This article does not provide a direct comparison between this technology and traditional adhesive methods. It would be beneficial to understand the specific advantages and disadvantages of this innovative approach in comparison to conventional techniques.

1. 1. 1. What are the cost implications of implementing this technology in manufacturing processes?

The article does not address the cost implications of using this technology in manufacturing. Understanding the potential costs associated with adopting this innovation is crucial for businesses looking to integrate it into their production processes.

Original Abstract Submitted

An adhesive member includes: a conductive particle layer including a plurality of conductive particles; a non-conductive layer disposed on the conductive particle layer; and a screening layer interposed between the conductive particle layer and the non-conductive layer and includes a plurality of screening members spaced apart from each other.