18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Tze-Chiang Huang of Saratoga CA (US)
Yun-Han Lee of Hsinchu County (TW)
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18169579 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes multiple semiconductor dies electrically coupled to each other through a semiconductor bridge. The bridge overlaps the corners of the semiconductor dies, allowing for efficient electrical coupling between them.
- The semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent to each other.
- A semiconductor bridge overlaps a corner of the first semiconductor die and a corner of the second semiconductor die, electrically coupling them.
- The package also includes a third semiconductor die and a fourth semiconductor die, each electrically coupled to the first and second semiconductor dies, respectively.
- The semiconductor bridge is interposed between the third and fourth semiconductor dies.
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This innovation solves the problem of efficiently and effectively electrically coupling multiple semiconductor dies within a single package.
Benefits
The benefits of this technology include improved performance, increased functionality, and enhanced reliability of semiconductor packages.
Potential Commercial Applications
This technology could be commercially applied in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of wire bonding or flip-chip technology to electrically connect semiconductor dies within a package.
Unanswered Questions
How does the semiconductor bridge ensure reliable electrical coupling between the semiconductor dies?
The semiconductor bridge is designed to overlap the corners of the semiconductor dies, providing a secure and efficient electrical connection. However, the specific mechanism of this coupling process is not detailed in the abstract.
What are the specific dimensions and materials used in the semiconductor bridge?
The abstract does not provide information on the exact dimensions or materials of the semiconductor bridge, which could be crucial factors in the performance and reliability of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.
