Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract
Contents
- 1 Fan-Out Package with Cavity Substrate
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Fan-Out Package with Cavity Substrate - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Fan-Out Package with Cavity Substrate
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Po-Hao Tsai of Taoyuan City (TW)
Techi Wong of Zhubei City (TW)
Meng-Wei Chou of Zhubei City (TW)
Meng-Liang Lin of Hsinchu (TW)
Fan-Out Package with Cavity Substrate - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105705 titled 'Fan-Out Package with Cavity Substrate
Simplified Explanation
The abstract describes structures and methods for forming fan-out packages, which may include a cavity substrate, semiconductor devices in the cavity, and redistribution structures.
- Cavity substrate with preformed cavity for accommodating semiconductor devices.
- Semiconductor devices such as integrated circuit dies placed in the cavity.
- Redistribution structures formed to facilitate connections within the package.
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging industry
- Electronics manufacturing
- Consumer electronics
Problems Solved
The innovation addresses the following issues:
- Efficient packaging of semiconductor devices
- Facilitating connections within the package
- Reducing package size and weight
Benefits
The technology offers the following benefits:
- Improved performance of semiconductor devices
- Enhanced reliability of connections
- Cost-effective packaging solutions
Potential Commercial Applications
- "Innovative Fan-Out Package Structures for Semiconductor Devices"
Possible Prior Art
There may be prior art related to fan-out packaging techniques in the semiconductor industry, but specific examples are not provided in the abstract.
Unanswered Questions
How does the technology impact the overall cost of semiconductor packaging?
The abstract does not mention the cost implications of implementing these fan-out package structures. It would be interesting to know if this technology leads to cost savings in semiconductor packaging processes.
What are the environmental implications of using these fan-out packages?
The abstract does not discuss the environmental aspects of the technology. It would be valuable to understand if these packages have any environmental advantages or disadvantages compared to traditional packaging methods.
Original Abstract Submitted
structures and methods of forming fan-out packages are provided. the packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. embodiments include a cavity preformed in a cavity substrate. various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. redistribution structures may also be formed.
