18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Mao-Yen Chang of Kaohsiung City (TW)
Chih-Wei Lin of Hsinchu County (TW)
Hao-Yi Tsai of Hsinchu City (TW)
Kuo-Lung Pan of Hsinchu city (TW)
Chun-Cheng Lin of New Taipei City (TW)
Tin-Hao Kuo of Hsinchu City (TW)
Yu-Chia Lai of Miaoli County (TW)
Chih-Hsuan Tai of Taipei City (TW)
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18499242 titled 'METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
Simplified Explanation
The method involves bonding components onto a semiconductor wafer, with some components overhanging the wafer's periphery.
- Components are bonded onto a semiconductor wafer.
- Some components overhang the wafer's periphery.
- A barrier structure is formed between components and the wafer.
- An underfill structure is formed under certain components, with the barrier structure preventing spreading.
---
- Potential Applications
- Semiconductor manufacturing
- Electronics assembly
- Problems Solved
- Preventing spreading of underfill material
- Ensuring proper bonding of components
- Benefits
- Improved reliability of semiconductor structures
- Enhanced performance of electronic devices
Original Abstract Submitted
A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang of Kaohsiung City (TW)
- Chih-Wei Lin of Hsinchu County (TW)
- Hao-Yi Tsai of Hsinchu City (TW)
- Kuo-Lung Pan of Hsinchu city (TW)
- Chun-Cheng Lin of New Taipei City (TW)
- Tin-Hao Kuo of Hsinchu City (TW)
- Yu-Chia Lai of Miaoli County (TW)
- Chih-Hsuan Tai of Taipei City (TW)
- H01L23/00
- H01L21/56
- H01L23/538
- H01L25/00
- H01L25/18