Samsung electronics co., ltd. (20240105703). FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME simplified abstract

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Jaehyun Lim of Suwon-si (KR)

Kwangjin Lee of Suwon-si (KR)

Hyunjong Moon of Suwon-si (KR)

Inho Choi of Suwon-si (KR)

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105703 titled 'FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

Simplified Explanation

The abstract describes a fingerprint sensor package comprising a first substrate with a through-hole, a second substrate with sensing patterns, a conductive support connecting bonding pads on the substrates, a controller chip, and a molding layer.

• The package includes a first substrate with a through-hole and bonding pads, a second substrate with sensing patterns and bonding pads, a conductive support connecting the bonding pads, a controller chip, and a molding layer.
• The first substrate has a core insulating layer with bonding pads and an external connection pad.
• The second substrate has sensing patterns spaced apart in different directions.
• The conductive support electrically connects the bonding pads on the substrates and supports them.
• The controller chip is located on the second substrate.
• The molding layer is on the second surface of the first substrate.

Potential Applications

This technology can be used in:

• Biometric security systems
• Access control systems
• Mobile devices

Problems Solved

This technology solves issues related to:

• Secure authentication
• Accurate fingerprint recognition
• Compact and reliable sensor packaging

Benefits

The benefits of this technology include:

• Enhanced security
• Improved user experience
• Compact design

Potential Commercial Applications

The potential commercial applications of this technology include:

• Smartphone manufacturers
• Security system providers
• Biometric sensor companies

Possible Prior Art

One possible prior art for this technology could be traditional fingerprint sensor packages with separate substrates for sensing and processing.

What are the manufacturing processes involved in creating this fingerprint sensor package?

The manufacturing processes involved in creating this fingerprint sensor package include substrate preparation, bonding pad deposition, sensing pattern fabrication, conductive support assembly, controller chip integration, and molding layer application.

How does this fingerprint sensor package compare to other biometric authentication methods in terms of security and accuracy?

This fingerprint sensor package offers high security and accuracy compared to other biometric authentication methods due to the unique sensing patterns and reliable conductive support system.

Original Abstract Submitted

a fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.