17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
MULTI-DIE PACKAGE AND METHODS OF FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wen-Yi Lin of New Taipei City (TW)
Kuang-Chun Lee of New Taipei City (TW)
Chien-Li Kuo of Hsinchu City (TW)
Kuo-Chio Liu of Hsinchu City (TW)
MULTI-DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17823856 titled 'MULTI-DIE PACKAGE AND METHODS OF FORMATION
Simplified Explanation
Some implementations described herein provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.
- Multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die.
- Heat transfer component, such as a dome-shaped structure, is placed between the two dies.
- Underfill material envelops the heat transfer component to aid in heat transfer.
- Thermal circuit within the package quickly spreads and transfers heat to maintain system-on-chip integrated circuit die temperature below a threshold.
Potential Applications
- High-performance computing systems
- Data centers
- Mobile devices
Problems Solved
- Overheating of system-on-chip integrated circuit die
- Thermal management in multi-die packages
Benefits
- Improved heat dissipation
- Enhanced reliability and performance
- Extended lifespan of integrated circuits
Original Abstract Submitted
Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.
