Samsung electronics co., ltd. (20240128195). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangwoong Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128195 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first redistribution structure, a first semiconductor chip, an encapsulant, first conductive posts, a heat dissipation member, and a second semiconductor chip. The first semiconductor chip is connected to the first redistribution structure through the first conductive posts and overlaps them in one direction. The heat dissipation member overlaps the first semiconductor chip in a different direction, and the second semiconductor chip is positioned between the first redistribution structure and the heat dissipation member.
- First redistribution structure
- First semiconductor chip
- Encapsulant
- First conductive posts
- Heat dissipation member
- Second semiconductor chip
Potential Applications
The technology described in this patent application could be used in various electronic devices that require efficient heat dissipation and electrical connections between semiconductor chips.
Problems Solved
This technology solves the problem of heat dissipation in semiconductor packages while also providing reliable electrical connections between chips.
Benefits
- Improved heat dissipation - Enhanced electrical connectivity - Compact design
Potential Commercial Applications
- Semiconductor industry
- Consumer electronics
- Automotive electronics
Possible Prior Art
There may be prior art related to semiconductor packaging techniques that involve heat dissipation and electrical connections between chips. One example could be the use of heat sinks in semiconductor packages.
Unanswered Questions
How does the heat dissipation member improve the overall performance of the semiconductor package?
The heat dissipation member helps to dissipate heat generated by the semiconductor chips, preventing overheating and potential damage. This can lead to improved performance and reliability of the electronic device.
What materials are typically used for the encapsulant in semiconductor packaging?
The encapsulant is usually made of materials such as epoxy resins or silicone compounds that provide insulation and protection for the semiconductor chips. These materials need to have good thermal conductivity and mechanical properties to ensure the stability of the package.
Original Abstract Submitted
a semiconductor package includes a first redistribution structure, a first semiconductor chip disposed on an upper surface of the first redistribution structure, an encapsulant disposed between the first redistribution structure and the first semiconductor chip, a plurality of first conductive posts electrically connecting the first redistribution structure and the first semiconductor chip with each other, and penetrating through the encapsulant in a first direction, a heat dissipation member having at least a portion that overlaps the first semiconductor chip in a second direction that is perpendicular to the first direction, and a second semiconductor chip disposed between the first redistribution structure and the heat dissipation member, and encapsulated by the encapsulant. the first semiconductor chip overlaps the plurality of first conductive posts in the first direction. the first semiconductor chip does not overlap the second semiconductor chip in the first direction.
