17899025. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Hyunsoo Chung of Hwaseong-si (KR)
Younglyong Kim of Anyang-si (KR)
Sangcheon Park of Hwaseong-si (KR)
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17899025 titled 'SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a first semiconductor chip with a front surface and a rear surface. It also has a recess portion that extends into the first substrate through an insulating layer, and a protective insulating layer that covers the inner side and bottom surface of the recess portion. The package further includes a through electrode that extends from the front surface through the bottom surface of the recess portion and the protective insulating layer, and a first connection pad that contacts the through electrode in the recess portion.
- The first semiconductor chip has a flat upper surface defined by the upper surfaces of the insulating layer, protective insulating layer, and first connection pad.
- A second semiconductor chip is placed on top of the first semiconductor chip.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be utilized in automotive electronics, medical devices, and industrial equipment.
Problems solved by this technology:
- The recess portion and protective insulating layer provide protection to the through electrode and connection pad, preventing damage or short circuits.
- The flat upper surface of the first semiconductor chip allows for easy placement of the second semiconductor chip.
Benefits of this technology:
- The protective insulating layer ensures the reliability and durability of the through electrode and connection pad.
- The flat upper surface simplifies the assembly process and improves the overall performance of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip including a first substrate having a front surface and a rear surface, a first insulating layer on the rear surface, a recess portion extending into the first substrate through the first insulating layer, a protective insulating layer extending along an inner side surface and a bottom surface of the recess portion, a through electrode extending from the front surface through the bottom surface of the recess portion and the protective insulating layer, and a first connection pad contacting the through electrode in the recess portion, and surrounded by the protective insulating layer, the first semiconductor chip having a flat upper surface defined by upper surfaces of the first insulating layer, the protective insulating layer, the first connection pad; and a second semiconductor chip disposed on the upper surface of the first semiconductor chip.
