Taiwan semiconductor manufacturing company, ltd. (20240136346). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chien Hung Liu of Hsinchu County (TW)

Yu-Sheng Chen of Taoyuan City (TW)

Yi Ching Ong of Hsinchu (TW)

Hsien Jung Chen of Tainan City (TW)

Kuen-Yi Chen of Hsinchu City (TW)

Kuo-Ching Huang of Hsinchu City (TW)

Harry-HakLay Chuang of Zhubei City (TW)

Wei-Cheng Wu of Zhubei City (TW)

Yu-Jen Wang of Hsinchu City (TW)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136346 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Simplified Explanation

The semiconductor die package described in the abstract includes an inductor-capacitor (LC) semiconductor die directly bonded with a logic semiconductor die. The LC semiconductor die integrates inductors and capacitors into a single die, which can be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit. This integration of passive components into a single semiconductor die reduces signal propagation distances, increases operating efficiency, reduces form factor, and improves the performance of the voltage regulator circuit.

• Integration of inductors and capacitors into a single semiconductor die
• Reduction of signal propagation distances
• Increase in operating efficiency
• Reduction in form factor
• Improvement in performance of the voltage regulator circuit

Potential Applications

The technology described in this patent application could be applied in various electronic devices requiring voltage regulation, such as power supplies, battery chargers, and voltage converters.

Problems Solved

This technology solves the problem of signal propagation distances in voltage regulator circuits, as well as issues related to operating efficiency, form factor, parasitic capacitance, and parasitic inductance.

Benefits

The benefits of this technology include increased efficiency, improved performance, reduced form factor, and enhanced reliability of voltage regulator circuits.

Potential Commercial Applications

One potential commercial application of this technology could be in the development of more compact and efficient power management solutions for mobile devices, IoT devices, and other electronics.

Possible Prior Art

One possible prior art for this technology could be the integration of passive components into semiconductor dies for various applications in the electronics industry.

Unanswered Questions

How does the integration of inductors and capacitors into a single die impact the overall cost of manufacturing the semiconductor die package?

The abstract does not provide information on the cost implications of this integration.

Are there any limitations or drawbacks to integrating passive components into a single semiconductor die for voltage regulation purposes?

The abstract does not mention any potential limitations or drawbacks associated with this integration.

Original Abstract Submitted

a semiconductor die package includes an inductor-capacitor (lc) semiconductor die that is directly bonded with a logic semiconductor die. the lc semiconductor die includes inductors and capacitors that are integrated into a single die. the inductors and capacitors of the lc semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. the integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.