17899592. STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
Chin Hui Chong of Singapore (SG)
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17899592 titled 'STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
The abstract describes a semiconductor device with a stacked capacitor, die stack, and package substrate.
- Package substrate with an inner surface
- Die stack on the inner surface
- Stacked capacitor device adjacent to the die stack
- Semiconductor dies electrically coupled to the inner surface
- Bond wires and/or solder structures used for electrical coupling
- Stacked capacitor device includes first capacitor, interposer, and second capacitor
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- Potential Applications
- Integrated circuits
- Memory devices
- Power management systems
- Problems Solved
- Enhanced performance of semiconductor devices
- Improved electrical coupling
- Increased capacitance in a compact space
- Benefits
- Higher efficiency
- Increased functionality
- Compact design
- Improved reliability
Original Abstract Submitted
Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.
