18099092. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Hyungu Kang of Hwaseong-si (KR)
Jaekyu Sung of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099092 titled 'SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
Simplified Explanation
The abstract describes a semiconductor package that includes a semiconductor chip and a package substrate. The package also includes conductive connections that connect the chip to the substrate. Additionally, there are multiple towers, each containing multiple memory chips, which are positioned apart from each other. The lowermost memory chip in each tower overlaps the semiconductor chip when viewed from the top. Adhesive layers are used to attach the lowermost memory chips to the semiconductor chip.
- The semiconductor package includes a semiconductor chip and a package substrate.
- Conductive connections are used to connect the chip to the substrate.
- Multiple towers, each containing multiple memory chips, are positioned apart from each other.
- The lowermost memory chip in each tower overlaps the semiconductor chip when viewed from the top.
- Adhesive layers are used to attach the lowermost memory chips to the semiconductor chip.
Potential Applications
- This semiconductor package design can be used in various electronic devices that require memory chips, such as smartphones, tablets, and computers.
- It can be utilized in high-performance computing systems that require efficient memory management.
- The design can be applied in automotive electronics for improved memory integration.
Problems Solved
- The design solves the problem of limited space in semiconductor packages by vertically stacking memory chips.
- It addresses the challenge of connecting multiple memory chips to a semiconductor chip in a compact manner.
- The design solves the issue of thermal management by allowing for efficient heat dissipation.
Benefits
- The vertical stacking of memory chips allows for increased memory capacity in a smaller footprint.
- The compact design enables improved performance and efficiency in electronic devices.
- The adhesive layers provide secure attachment and reliable electrical connections between the memory chips and the semiconductor chip.
Original Abstract Submitted
A semiconductor package may include a semiconductor chip on a package substrate. The semiconductor package may include a plurality of conductive connections connecting the semiconductor chip to the package substrate may be disposed, a plurality of towers which are apart from one another and each include a plurality of memory chips may be disposed, wherein a lowermost memory chip of each of the plurality of towers overlaps the semiconductor chip from a top-down view. The semiconductor package further includes a plurality of adhesive layers be attached between the lowermost memory chip of each of the plurality of towers and the semiconductor chip.
