17458573. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shu-Jung Tseng of Taichung County (TW)

Hui-Chang Yu of Hsinchu County (TW)

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17458573 titled 'SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a semiconductor package and semiconductor device. It includes a package, a first integrated passive device, and a second integrated passive device. The first integrated passive device is located below the package, while the second integrated passive device is positioned between the package and the first integrated passive device. The first integrated passive device is electrically connected to the package through the second integrated passive device.

  • The semiconductor package includes multiple integrated passive devices.
  • The first integrated passive device is placed below the package.
  • The second integrated passive device is positioned between the package and the first integrated passive device.
  • The first integrated passive device is connected to the package through the second integrated passive device.

Potential Applications

  • This technology can be applied in various semiconductor devices and packages.
  • It can be used in electronic devices such as smartphones, tablets, and computers.
  • The semiconductor package can be utilized in automotive electronics, medical devices, and industrial equipment.

Problems Solved

  • The integration of multiple passive devices in a semiconductor package is addressed.
  • The positioning of the first integrated passive device below the package helps optimize space utilization.
  • The electrical connection between the first integrated passive device and the package is facilitated through the second integrated passive device.

Benefits

  • Improved space utilization within the semiconductor package.
  • Enhanced electrical connectivity between the integrated passive devices and the package.
  • Enables the integration of multiple passive devices in a single package.


Original Abstract Submitted

Disclosed are semiconductor packages and semiconductor devices. In one embodiment, a semiconductor package includes a package, a first integrated passive device, and a second integrated passive device. The first integrated passive device is disposed below the package. The second integrated passive device is disposed between the package and the first integrated passive device. The first integrated passive device is electrically connected to the package through the second integrated passive device.

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