18135927. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Jeonghoon Ahn of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18135927 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor chip described in the patent application includes a semiconductor substrate with a through electrode, a bonding pad with a first conductive pad connected to the through electrode, and a second conductive pad on the central portion of the first conductive pad. There is also a pad insulating layer on the semiconductor substrate surrounding the sidewalls of the first and second conductive pads.
- Semiconductor chip with through electrode and bonding pad design
- First conductive pad connected to through electrode
- Second conductive pad on central portion of first conductive pad
- Outer portion of first conductive pad protrudes outwardly relative to sidewall of second conductive pad
- Pad insulating layer surrounds sidewalls of first and second conductive pads
- Potential Applications
- Semiconductor packaging
- Integrated circuits
- Microelectronics
- Problems Solved
- Improved connectivity in semiconductor chips
- Enhanced reliability in electronic devices
- Better performance in integrated circuits
- Benefits
- Increased efficiency in semiconductor packaging
- Enhanced signal transmission
- Improved overall functionality of electronic devices
Original Abstract Submitted
A semiconductor chip and a semiconductor package, the semiconductor chip includes a semiconductor substrate; a through electrode penetrating the semiconductor substrate; a bonding pad including a first conductive pad connected to the through electrode, and a second conductive pad on a central portion of the first conductive pad, an outer portion of the first conductive pad protruding outwardly relative to a sidewall of the second conductive pad; and a pad insulating layer on the semiconductor substrate and surrounding a sidewall of the first conductive pad and the sidewall of the second conductive pad.
