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Category:H01L21/683
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Pages in category "H01L21/683"
The following 140 pages are in this category, out of 140 total.
1
- 17541946. SILICON HANDLER WITH LASER-RELEASE LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17590717. METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17614662. DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17730993. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)
- 17833438. CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17838491. Semiconductor Wafer Dicing Method simplified abstract (Western Digital Technologies, Inc.)
- 17848246. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS simplified abstract (Intel Corporation)
- 17850478. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17872473. CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
- 17876381. VACUUM CHUCK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17887729. ADJUSTABLE WAFER CHUCK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17897196. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17932050. PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17940265. APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17949258. CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF simplified abstract (Intel Corporation)
- 17961335. System and Method for Plasma Process Uniformity Control simplified abstract (Tokyo Electron Limited)
- 17962410. BIPOLAR ELECTROSTATIC CHUCK FOR ETCH CHAMBER simplified abstract (Applied Materials, Inc.)
- 17974871. PLANARIZATION APPARATUS AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18049328. DICING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18060853. Semiconductor Package with Multiple Redistribution Substrates simplified abstract (Samsung Electronics Co., Ltd.)
- 18081281. ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18113163. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18124954. SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQUIPMENT INCLUDING THE SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18136448. PLASMA PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18165447. MAGNETIC PROPERTY MEASURING SYSTEM, A METHOD FOR MEASURING MAGNETIC PROPERTIES, AND A METHOD FOR MANUFACTURING A MAGNETIC MEMORY DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18171315. PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171992. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Kioxia Corporation)
- 18172975. WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract (QUALCOMM Incorporated)
- 18211887. FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18216675. EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18234937. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., LTD.)
- 18237673. ELECTROSTATIC CHUCK ASSEMBLY FOR CRYOGENIC APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18242388. WAFER PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18243664. THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (MICRON TECHNOLOGY, INC.)
- 18243725. WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18255037. SUBSTRATE FOR CARRYING WAFER simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18275548. ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME simplified abstract (LG ELECTRONICS INC.)
- 18314983. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18318239. CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18332508. PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18357725. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18359000. SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18371641. FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18372811. LARGE DIAMETER POROUS PLUG FOR ARGON DELIVERY simplified abstract (Applied Materials, Inc.)
- 18372818. SOFT-CHUCKING SCHEME FOR IMPROVED BACKSIDE PARTICLE PERFORMANCE simplified abstract (Applied Materials, Inc.)
- 18381288. SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL simplified abstract (RESONAC CORPORATION)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18469684. SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18494784. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18502086. METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18504007. WAFER CHUCK, METHOD FOR PRODUCING THE SAME, AND EXPOSURE APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18506111. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18520971. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522271. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)
- 18525273. Semiconductor Device with Discrete Blocks simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18526350. SUBSTRATE PROCESSING APPARATUS simplified abstract (TOKYO ELECTRON LIMITED)
2
- 20240012341. ELECTROSTATIC CLAMP simplified abstract (ASML Netherlands B.V.)
- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240055274. SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (PHOENIX PIONEER TECHNOLOGY CO., LTD.)
- 20240055289. VACUUM SEAL FOR ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
- 20240087923.CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (samsung electronics co., ltd.)
- 20240087940.WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (samsung electronics co., ltd.)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
I
K
- Kioxia corporation (20240096607). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- Kioxia corporation (20240096682). PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
L
S
- Samsung display co., ltd. (20240096679). SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract
- Samsung display co., ltd. (20240120230). APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF simplified abstract
- Samsung display co., ltd. (20240131555). DEPOSITION APPARATUS simplified abstract
- Samsung Display Co., Ltd. patent applications on April 11th, 2024
- Samsung Display Co., LTD. patent applications on April 25th, 2024
- Samsung Display Co., LTD. patent applications on February 29th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240096637). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105470). SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105662). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128098). EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136216). WAFER PROCESSING APPARATUS simplified abstract
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096760). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105631). Three-Dimensional Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105632). Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120314). ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136299). SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
U
- US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
- US Patent Application 17829132. PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
- US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract
- US Patent Application 18143983. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18150557. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE simplified abstract
- US Patent Application 18231751. SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION simplified abstract
- US Patent Application 18233751. METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE simplified abstract
- US Patent Application 18303929. DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS simplified abstract
- US Patent Application 18358904. METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR simplified abstract
- US Patent Application 18360656. PACKAGE WITH FAN-OUT STRUCTURES simplified abstract
- US Patent Application 18362287. SEMICONDUCTOR WAFER STORAGE DEVICE simplified abstract
- US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447519. SEMICONDUCTOR PROCESSING METHOD AND APPARATUS simplified abstract
- US Patent Application 18447943. Plasma-Assisted Etching Of Metal Oxides simplified abstract