18318239. CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD
Organization Name
Inventor(s)
CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18318239 titled 'CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD
Simplified Explanation
The chip pick-up head is designed to detach and pick up chips from an adhesive film using a collet in contact with the chip's upper surface.
- Collet in contact with chip's upper surface
- Detaches and picks up chip from adhesive film
- Head part coupled to collet
- Vibration transfer rod transfers vibration to head part and collet
- Vibration generator generates the vibration
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
Problems Solved
- Efficient and precise chip handling
- Minimizing damage to delicate chips
Benefits
- Improved productivity
- Reduced waste
- Enhanced quality control
Original Abstract Submitted
A chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. The chip pick-up head detaches and picks up the chip from an adhesive film. The chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration to the head part and the collet, and a vibration generator coupled to the vibration transfer rod and configured to generate the vibration.
