SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17897196 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor structure described in the patent application includes a composite redistribution structure, a first interconnect device, and an integrated circuit (IC) package component. The composite redistribution structure consists of three redistribution structures, with the second redistribution structure positioned between the first and third redistribution structures. The first interconnect device is embedded in the second redistribution structure, with metal connectors that are leveled with the surface of the structure and electrically connected to the third redistribution structure. The IC package component is placed over the third redistribution structure and electrically connected to the first interconnect device through the third redistribution structure.

The semiconductor structure includes a composite redistribution structure with three redistribution structures.
A first interconnect device is embedded in the second redistribution structure.
The first interconnect device has metal connectors that are leveled with the surface of the structure.
The IC package component is connected to the first interconnect device through the third redistribution structure.

Potential Applications

Advanced semiconductor packaging technology
High-performance integrated circuits
Improved electrical connectivity in semiconductor devices

Problems Solved

Enhanced electrical connectivity in semiconductor structures
Improved integration of interconnect devices in IC packages

Benefits

Increased performance and reliability of integrated circuits
Enhanced functionality of semiconductor devices
Improved signal transmission capabilities

Original Abstract Submitted

A semiconductor structure includes a composite redistribution structure, a first interconnect device and an integrated circuit (IC) package component. The composite redistribution structure includes a first redistribution structure, a second redistribution structure and a third redistribution structure. The second redistribution structure is located between the first redistribution structure and the third redistribution structure. The first interconnect device is embedded in the second redistribution structure. The first interconnect device includes a plurality of metal connectors leveled with a surface of the second redistribution structure and electrically connected to the third redistribution structure. The IC package component is disposed over the third redistribution structure and electrically connected to the first interconnect device via the third redistribution structure.

17897196. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Contents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Inventor(s)