Taiwan semiconductor manufacturing company, ltd. (20240136299). SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chun-Chih Chuang of Taichung (TW)
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136299 titled 'SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Simplified Explanation
The patent application describes a package with an interposer structure that does not contain any active devices. The interposer structure includes an interconnect device, a dielectric film surrounding the interconnect device, and a first metallization pattern bonded to the interconnect device. Additionally, the package includes a first device die bonded to the opposing side of the first metallization pattern as the interconnect device, and a second device die bonded to the same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
- Interposer structure with interconnect device, dielectric film, and metallization pattern
- First device die bonded to one side of the metallization pattern
- Second device die bonded to the same side of the metallization pattern as the first device die
- Interconnect device electrically connects the first device die to the second device die
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuits
- Electronics manufacturing
Problems Solved
This technology helps address the following issues:
- Improving electrical connections between device dies
- Enhancing package reliability
- Increasing package density
Benefits
The technology offers the following benefits:
- Enhanced electrical connectivity
- Improved package performance
- Increased efficiency in electronics manufacturing
Potential Commercial Applications
The technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be the use of interposer structures in semiconductor packaging to improve electrical connections between device dies.
Unanswered Questions
How does this technology compare to existing interposer structures in terms of performance and reliability?
This article does not provide a direct comparison between this technology and existing interposer structures. Further research or testing may be needed to determine the performance and reliability differences.
What are the specific manufacturing processes involved in creating the interposer structure described in the patent application?
The article does not detail the specific manufacturing processes used to create the interposer structure. Additional information or documentation may be required to understand the manufacturing techniques involved.
Original Abstract Submitted
a package includes an interposer structure free of any active devices. the interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. the package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. the interconnect device electrically connects the first device die to the second device die.
