17848246. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS simplified abstract (Intel Corporation)
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS
Organization Name
Inventor(s)
Han-Wen Lin of Zhubei City (TW)
Yin-Ying Chen of Hsinchu City (TW)
Hans Gerard Jetten of Anzing (DE)
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17848246 titled 'MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS
Simplified Explanation
The abstract describes a patent application for microelectronic assemblies, related devices, and methods. The assembly includes a first die with two surfaces, a redistribution layer (RDL) with a surface, and a second die. The first surface of the first die is electrically connected to the surface of the RDL using non-solder interconnects, while the second die is directly connected to the second surface of the first die using solder interconnects.
- The patent application is for a microelectronic assembly with a specific configuration of interconnects.
- The assembly includes a first die, a redistribution layer (RDL), and a second die.
- The first die has two surfaces, and the first surface is connected to the RDL using non-solder interconnects.
- The second die is directly connected to the second surface of the first die using solder interconnects.
Potential Applications
- Microelectronics manufacturing
- Semiconductor industry
- Electronic devices and systems
Problems Solved
- Improved electrical coupling between different components in a microelectronic assembly
- Enhanced reliability and performance of microelectronic devices
- Efficient use of space in microelectronic assemblies
Benefits
- Higher electrical connectivity and signal transmission efficiency
- Increased reliability and durability of microelectronic devices
- Compact and space-saving design for microelectronic assemblies
Original Abstract Submitted
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface; a redistribution layer (RDL) having a surface, wherein the first surface of the first die is on and electrically coupled to the surface of the RDL by non-solder interconnects; and a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by solder interconnects.
