18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chih-Chiang Tsao of Taoyuan (TW)

Hsuan-Ting Kuo of Taichung (TW)

Chao-Wei Chiu of Hsinchu (TW)

Hsiu-Jen Lin of Zhubei (TW)

Ching-Hua Hsieh of Hsinchu (TW)

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18152502 titled 'INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

Simplified Explanation

The method described in the patent application involves depositing solder paste on the contact pads of a first package component, aligning spring connectors from a second package component to the solder paste, and reflowing the solder paste to physically and electrically connect the spring connectors to the contact pads.

  • Solder paste is deposited on contact pads of a first package component.
  • Spring connectors from a second package component are aligned to the solder paste.
  • The solder paste is reflowed to connect the spring connectors to the contact pads.
  • The device includes a first package component and a second package component connected by spring coils extending between them.

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      1. Potential Applications
  • Electronics manufacturing
  • Circuit board assembly
      1. Problems Solved
  • Efficient and reliable electrical and physical coupling of package components
  • Simplified assembly process
      1. Benefits
  • Improved connectivity between package components
  • Cost-effective manufacturing process
  • Enhanced reliability of electronic devices


Original Abstract Submitted

A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

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