18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Zi-Jheng Liu of Taoyuan City (TW)

Jo-Lin Lan of Kaohsiung City (TW)

Yu-Hsiang Hu of Hsinchu City (TW)

Hung-Jui Kuo of Hsinchu City (TW)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18485291 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a device that includes a molding compound, through vias, a seal ring structure, and a protection layer. The through vias are embedded in the molding compound, while the seal ring structure surrounds the through vias in a top view. The protection layer covers the seal ring and extends towards the molding compound in a cross-sectional view.

  • The device includes a molding compound, through vias, a seal ring structure, and a protection layer.
  • The through vias are embedded in the molding compound.
  • The seal ring structure surrounds the through vias in a top view.
  • The protection layer covers the seal ring and extends towards the molding compound in a cross-sectional view.

Potential applications of this technology:

  • Integrated circuits and electronic devices that require through vias for interconnection.
  • Devices that need protection against environmental factors such as moisture, dust, or physical damage.
  • High-density packaging solutions where space is limited.

Problems solved by this technology:

  • Ensures reliable electrical connections between different layers or components of the device.
  • Provides protection for the through vias and surrounding areas from external elements.
  • Enhances the overall durability and reliability of the device.

Benefits of this technology:

  • Improved performance and functionality of integrated circuits and electronic devices.
  • Increased lifespan and reliability due to enhanced protection.
  • Enables miniaturization and high-density packaging of electronic components.


Original Abstract Submitted

A device includes a molding compound, a plurality of through vias, a seal ring structure, and a protection layer. The plurality of through vias are embedded in the molding compound. The seal ring structure is over the molding compound and surrounds the through vias in a top view. The protection layer covers the seal ring and extends toward the molding compound in a cross-sectional view.

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