17730993. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME
Organization Name
Inventor(s)
Yeongbeom Ko of Cheonan-si (KR)
Hwayoung Lee of Hwaseong-si (KR)
Junggeun Shin of Cheonan-si (KR)
Kwangyong Lee of Anyang-si (KR)
Jongho Lee of Hwaseong-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17730993 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME
Simplified Explanation
The abstract describes a substrate processing apparatus that includes a chuck table with a curved mounting surface and a laser supply head. The laser supply head is used to irradiate the substrate with a laser beam.
- The chuck table has a mounting surface that is curved, allowing for better contact and stability when mounting the substrate.
- The laser supply head is designed to emit a laser beam that can be directed towards the substrate attached to the mounting table.
- The apparatus is used for processing substrates, which could include tasks such as cleaning, etching, or deposition.
Potential Applications
- Semiconductor manufacturing: The substrate processing apparatus can be used in the production of semiconductor devices, where precise and controlled processing of substrates is crucial.
- Display manufacturing: The apparatus can be utilized in the production of displays, such as LCD or OLED screens, to ensure accurate and efficient processing of the substrates.
- Solar cell manufacturing: The curved mounting surface and laser beam irradiation can be beneficial in the production of solar cells, allowing for improved efficiency and uniformity.
Problems Solved
- Improved substrate mounting: The curved mounting surface of the chuck table provides better contact and stability when mounting the substrate, reducing the risk of misalignment or damage during processing.
- Precise and controlled processing: The use of a laser beam allows for precise and controlled processing of the substrate, ensuring accurate results and minimizing defects.
- Enhanced efficiency: The substrate processing apparatus enables efficient processing of substrates, reducing processing time and increasing productivity.
Benefits
- Improved substrate processing: The curved mounting surface and laser beam irradiation contribute to improved processing of substrates, resulting in higher quality products.
- Increased productivity: The apparatus allows for efficient processing of substrates, reducing processing time and increasing overall productivity.
- Enhanced accuracy and control: The use of a laser beam enables precise and controlled processing, ensuring accurate results and minimizing errors.
Original Abstract Submitted
A substrate processing apparatus includes a chuck table including a mounting table having a mounting surface on which a substrate is mounted, wherein the mounting surface is a curved surface; and a laser supply head configured to irradiate the substrate attached to the mounting table with a laser beam.
