18243725. WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
Organization Name
Inventor(s)
Myoungchul Eum of Suwon-si (KR)
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243725 titled 'WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
Simplified Explanation
The patent application describes a wafer temporary adhesive tape with a laser decomposable material layer for attaching device wafers to carrier wafers.
- Device adhesive layer attaches to device wafer
- Base layer with laser decomposable material
- Carrier adhesive layer attaches to carrier wafer
- Laser beam can chemically decompose the base layer
Potential Applications
- Semiconductor manufacturing
- Microelectronics assembly
Problems Solved
- Secure attachment of device wafers to carrier wafers
- Easy removal of adhesive tape without damaging wafers
Benefits
- Improved wafer handling during manufacturing
- Reduced risk of wafer damage
- Enhanced efficiency in wafer processing
Original Abstract Submitted
A wafer temporary adhesive tape includes a device adhesive layer configured to be attached to a device wafer, a base layer on the device adhesive layer, and a carrier adhesive layer on the base layer and configured to be attached to a carrier wafer, wherein the base layer includes a laser decomposable material layer that can be chemically decomposed by absorbing a laser beam.
