18359000. SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME
Organization Name
Inventor(s)
Sang - Il Choi of Suwon-si (KR)
Seong Gi Jeon of Suwon-si (KR)
SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359000 titled 'SEMICONDUCTOR DEVICE FABRICATION APPARATUS AND SEMICONDUCTOR DEVICE FABRICATION METHOD USING THE SAME
Simplified Explanation
The semiconductor device fabrication apparatus described in the abstract includes a grinder, a laser emitter, and a mount for attaching a die attach film to a substrate.
- The grinder is used to grind the first surface of the substrate.
- The laser emitter emits a femtosecond pulse laser to the ground first surface of the substrate.
- The mount attaches a die attach film to the first surface of the substrate.
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- Potential Applications
- Semiconductor device fabrication
- Microelectronics manufacturing
- Problems Solved
- Efficient grinding of substrate surfaces
- Precise laser processing of substrate surfaces
- Secure attachment of die attach film
- Benefits
- Improved accuracy in substrate processing
- Enhanced productivity in semiconductor device fabrication
- Consistent quality in microelectronics manufacturing
Original Abstract Submitted
A semiconductor device fabrication apparatus including a grinder comprising a grinding part, the grinding part configured to grind a first surface of a substrate, a laser emitter configured to emit a femtosecond pulse laser to the first surface of the substrate transferred from the grinder, and a mount configured to attach a die attach film to the first surface of the substrate transferred from the laser emitter, wherein the grinding part is configured to grind the first surface of the substrate, which has been introduced into the grinder, and the laser emitter is configured to emit the femtosecond pulse laser to the ground first surface of the substrate may be provided.
