US Patent Application 18447519. SEMICONDUCTOR PROCESSING METHOD AND APPARATUS simplified abstract
Contents
SEMICONDUCTOR PROCESSING METHOD AND APPARATUS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shuang-Shiuan Deng of Hsinchu (TW)
SEMICONDUCTOR PROCESSING METHOD AND APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447519 titled 'SEMICONDUCTOR PROCESSING METHOD AND APPARATUS
Simplified Explanation
The abstract describes a method for securing a wafer to an electrostatic chuck in an apparatus and processing the wafer while it is secured.
- The method involves positioning the wafer on the electrostatic chuck.
- The wafer is secured to the electrostatic chuck by applying different voltages to different regions of the wafer and chuck at different times.
- This allows for precise and controlled securing of the wafer to the chuck.
- The wafer can then be processed by the apparatus while it remains securely attached to the chuck.
Original Abstract Submitted
A method includes: positioning a wafer on an electrostatic chuck of an apparatus; and securing the wafer to the electrostatic chuck by: securing a first wafer region of the wafer to a first chuck region of the electrostatic chuck by applying a first voltage at a first time. The method further includes securing a second wafer region of the wafer to a second chuck region of the electrostatic chuck by applying a second voltage at a second time different from the first time; and processing the wafer by the apparatus while the wafer is secured to the electrostatic chuck.
