17940265. APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE
Organization Name
Inventor(s)
Sunghyup Kim of Hwaseong-si (KR)
Dongkyeng Han of Suwon-si (KR)
APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17940265 titled 'APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE
Simplified Explanation
The patent application describes an apparatus that includes a chuck for holding a substrate, a fixing unit for applying force to fix the substrate to the chuck, and a controller for controlling the force applied to different zones of the chuck based on overlay distribution.
- The chuck has an upper surface that supports the substrate.
- The fixing unit generates force to fix the substrate to the chuck in a perpendicular direction.
- The controller divides the chuck into multiple zones on a plane perpendicular to the fixing direction.
- The division of zones is based on reference overlay distribution, which represents the degree of overlay deterioration when the substrate is fixed to the chuck.
- The controller individually controls the force applied to each zone of the chuck.
- The controller reduces the force applied to a zone with a high degree of overlay deterioration in the reference distribution.
Potential applications of this technology:
- Semiconductor manufacturing: This technology can be used in the fabrication of semiconductor devices, where precise alignment and overlay control are crucial.
- Display manufacturing: It can be applied in the production of displays, such as LCDs or OLEDs, to ensure accurate alignment of layers and components.
- Optics manufacturing: This technology can be utilized in the manufacturing of optical components, such as lenses or mirrors, to achieve precise alignment and positioning.
Problems solved by this technology:
- Overlay deterioration: By controlling the chucking force applied to different zones, this technology helps mitigate overlay deterioration, which can negatively impact the accuracy and quality of manufactured products.
- Alignment errors: The individual control of chucking force in different zones helps address alignment errors that may occur during the fixing process, leading to improved alignment accuracy.
Benefits of this technology:
- Enhanced overlay control: By reducing the chucking force in zones with high overlay deterioration, this technology improves overlay control, resulting in better alignment accuracy and reduced overlay errors.
- Increased manufacturing yield: The improved alignment accuracy and reduced overlay errors contribute to higher manufacturing yield, as fewer defective products are produced.
- Cost savings: By minimizing overlay errors and improving alignment accuracy, this technology helps reduce the need for rework or scrap, leading to cost savings in the manufacturing process.
Original Abstract Submitted
An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.
