18081281. ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

From WikiPatents
Jump to navigation Jump to search

ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Uiyong Kim of Hwaseong-si (KR)

ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18081281 titled 'ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Simplified Explanation

The abstract describes an electrostatic chuck that includes a chuck base and an upper plate. The upper plate has a base portion, a first contact pattern, a second contact pattern, and an outer dam. The outer dam surrounds the first and second contact pattern structures. The distance between the second contact pattern structure and the outer dam is smaller than the distance between the first contact pattern structure and the outer dam. The top surface of the second contact pattern structure has a higher surface roughness than the top surface of the first contact pattern structure.

  • The electrostatic chuck includes a chuck base and an upper plate.
  • The upper plate has a base portion, a first contact pattern, a second contact pattern, and an outer dam.
  • The outer dam surrounds the first and second contact pattern structures.
  • The distance between the second contact pattern structure and the outer dam is smaller than the distance between the first contact pattern structure and the outer dam.
  • The top surface of the second contact pattern structure has a higher surface roughness than the top surface of the first contact pattern structure.

Potential Applications

  • Semiconductor manufacturing
  • Flat panel display manufacturing
  • Microelectromechanical systems (MEMS) manufacturing

Problems Solved

  • Provides improved control and stability during manufacturing processes.
  • Reduces the risk of damage to delicate components.
  • Enhances the efficiency and accuracy of manufacturing processes.

Benefits

  • Enhanced control and stability during manufacturing processes.
  • Reduced risk of damage to delicate components.
  • Improved efficiency and accuracy of manufacturing processes.


Original Abstract Submitted

An electrostatic chuck according to the disclosure includes a chuck base, and an upper plate. The upper plate includes a base portion, and a first contact pattern, a second contact pattern and an outer dam protruding from the base portion. The outer dam surrounds the first contact pattern structure and the second contact pattern structure. A distance of the second contact pattern structure to the outer dam is less than a distance from the first contact pattern structure to the outer dam. A surface roughness of a top surface of the second contact pattern structure is greater than a surface roughness of a top surface of the first contact pattern structure.

Retrieved from "http://wikipatents.org/index.php?title=18081281._ELECTROSTATIC_CHUCK_INCLUDING_UPPER_PLATE_AND_SUBSTRATE_PROCESSING_APPARATUS_INCLUDING_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=26097"