17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR
Organization Name
Inventor(s)
Wonkeun Kim of Hwaseong-si (KR)
Myoungchul Eum of Asan-si (KR)
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 17740649 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR
Simplified Explanation
The patent application describes a method for protecting and dividing semiconductor chips using a protective film and a dicing laser. Here are the bullet points explaining the patent/innovation:
- The method involves preparing a protective film consisting of a base film and a protective layer laminated on its surface.
- The protective film is mounted on a semiconductor wafer, which has a rear surface attached to a dicing tape and a front surface opposite to the rear surface.
- The protective layer of the film is positioned on the front surface of the semiconductor wafer.
- The rear surface of the semiconductor wafer is irradiated with a dicing laser.
- After laser irradiation, the base film of the protective film is removed from the semiconductor wafer.
- The semiconductor wafer is then divided into individual semiconductor chips.
- Finally, the protective layer is removed from each individual semiconductor chip.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics manufacturing industry
- Integrated circuit production
Problems solved by this technology:
- Protects the semiconductor wafer during the dicing process, preventing damage or contamination.
- Facilitates the division of the semiconductor wafer into individual chips without causing any harm.
Benefits of this technology:
- Enhanced protection of semiconductor wafers during the dicing process.
- Improved efficiency and accuracy in dividing semiconductor wafers into individual chips.
- Reduction in the risk of damage or contamination during the manufacturing process.
Original Abstract Submitted
A method includes preparing a protective film including a base film and a protective layer laminated on a surface of the base film, mounting the protective film on a semiconductor wafer having a rear surface attached to a dicing tape and a front surface positioned opposite to the rear surface, the protective layer being disposed on the front surface, irradiating the rear surface of the semiconductor wafer with a dicing laser, removing the base film of the protective film from the semiconductor wafer, dividing the semiconductor wafer into individual semiconductor chips, and removing the protective layer from the individual semiconductor chips.
