18525273. Semiconductor Device with Discrete Blocks simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
- 1 Semiconductor Device with Discrete Blocks
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Device with Discrete Blocks - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Semiconductor Device with Discrete Blocks
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ching-Wen Hsiao of Hsinchu (TW)
Chen-Shien Chen of Zhubei City (TW)
Wei Sen Chang of Jinsha Township (TW)
Shou-Cheng Hu of Tai-Chung City (TW)
Semiconductor Device with Discrete Blocks - A simplified explanation of the abstract
This abstract first appeared for US patent application 18525273 titled 'Semiconductor Device with Discrete Blocks
Simplified Explanation
The abstract describes a semiconductor device utilizing blocks with through vias and integrated passive devices for PoP applications.
- The semiconductor device includes a die and a connection block encased in a molding compound.
- Interconnection layers are formed on surfaces of the die, connection block, and molding compound.
- One or more dies and/or packages may be attached to the interconnection layers.
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Advanced packaging technologies
- High-performance computing
- Mobile devices
Problems Solved
The technology addresses the following issues:
- Enhancing connectivity in semiconductor devices
- Improving signal integrity
- Increasing integration density
Benefits
The semiconductor device offers the following benefits:
- Enhanced performance
- Increased reliability
- Compact design
Potential Commercial Applications
The technology could find commercial applications in:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be the use of through vias in semiconductor devices for improved connectivity and performance.
Unanswered Questions
How does this technology compare to existing PoP solutions in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of this technology compared to existing PoP solutions.
What are the environmental implications of using integrated passive devices in semiconductor devices?
The article does not address the environmental impact of utilizing integrated passive devices in semiconductor devices.
Original Abstract Submitted
A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
