Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract

Semiconductor Device with Discrete Blocks

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Ching-Wen Hsiao of Hsinchu (TW)

Chen-Shien Chen of Zhubei City (TW)

Wei Sen Chang of Jinsha Township (TW)

Shou-Cheng Hu of Tai-Chung City (TW)

Semiconductor Device with Discrete Blocks - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113080 titled 'Semiconductor Device with Discrete Blocks

Simplified Explanation

The abstract describes a semiconductor device and method of manufacture involving connection blocks with through vias and integrated passive devices, encased in a molding compound with interconnection layers.

• Semiconductor device utilizing connection blocks with through vias and integrated passive devices
• Encased in molding compound with interconnection layers on die, connection block, and compound surfaces
• Can be used in pop applications (package on package)
• One or more dies/packages can be attached to interconnection layers

Potential Applications

The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor components.

Problems Solved

This technology solves the problem of achieving high-density interconnections in semiconductor devices while maintaining reliability and performance. By utilizing connection blocks with through vias and integrated passive devices, the device can be more compact and efficient.

Benefits

The benefits of this technology include increased integration density, improved performance, enhanced reliability, and potentially reduced manufacturing costs due to the simplified structure and assembly process.

Potential Commercial Applications

The semiconductor device with connection blocks and integrated passive devices could find applications in the telecommunications industry, automotive electronics, IoT devices, and other sectors requiring high-performance and compact semiconductor solutions.

Possible Prior Art

One possible prior art could be the use of through vias and integrated passive devices in semiconductor devices, but the specific combination with connection blocks and molding compound as described in the patent application may be novel.

How does this technology compare to existing semiconductor packaging methods?

This article does not provide a direct comparison to existing semiconductor packaging methods in terms of performance, cost, or reliability. Further analysis and testing would be needed to determine the advantages and disadvantages of this technology compared to current practices.

What are the specific manufacturing processes involved in creating the semiconductor device described in the patent application?

The article mentions the use of connection blocks, through vias, integrated passive devices, and interconnection layers, but it does not detail the specific manufacturing processes involved in creating these components and assembling them into a semiconductor device. More information on the fabrication techniques and assembly methods would be necessary to fully understand the technology.

Original Abstract Submitted

a semiconductor device and a method of manufacture are provided. in particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. embodiments such as those disclosed herein may be utilized in pop applications. in an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. one or more dies and/or packages may be attached to the interconnection layers.