US Patent Application 18233751. METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE simplified abstract
Contents
METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE
Organization Name
Inventor(s)
Liangfa Hu of San Jose CA (US)
Abdul Aziz Khaja of San Jose CA (US)
Sarah Michelle Bobek of Sunnyvale CA (US)
Prashant Kumar Kulshreshtha of San Jose CA (US)
Yoichi Suzuki of Funabashi-shi (JP)
METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18233751 titled 'METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE
Simplified Explanation
- The patent application is about reducing substrate backside damage during semiconductor device processing. - One method described in the application involves exposing the substrate to a plasma preheat treatment before applying a chucking voltage to a substrate support. - The substrate support described in the application includes a body with an electrode and thermal control device, as well as substrate supporting features on the upper surface. - Each substrate supporting feature has a substrate supporting surface and a rounded edge. - The purpose of these features is to provide better support for the substrate and reduce the risk of damage during processing.
Original Abstract Submitted
Embodiments of the present disclosure generally relate to apparatus and methods for reducing substrate backside damage during semiconductor device processing. In one implementation, a method of chucking a substrate in a substrate process chamber includes exposing the substrate to a plasma preheat treatment prior to applying a chucking voltage to a substrate support. In one implementation, a substrate support is provided and includes a body having an electrode and thermal control device disposed therein. A plurality of substrate supporting features are formed on an upper surface of the body, each of the substrate supporting features having a substrate supporting surface and a rounded edge.
