18242388. WAFER PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 WAFER PROCESSING APPARATUS
WAFER PROCESSING APPARATUS
Organization Name
Inventor(s)
Youngho Hwang of Suwon-si (KR)
WAFER PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18242388 titled 'WAFER PROCESSING APPARATUS
Simplified Explanation
The wafer processing apparatus described in the patent application includes a plate with support pins for mounting a wafer, vacuum ports for fixing the wafer in place, a heater for heating the plate, a flow regulator for adjusting the flow rate of a fluid into the vacuum ports, and a chuck controller for controlling the flow rate of the fluid during the heating process of the wafer.
- Support pins for mounting the wafer
- Vacuum ports for fixing the wafer in place
- Heater for heating the plate
- Flow regulator for adjusting fluid flow rate
- Chuck controller for controlling fluid flow rate during heating process
Potential Applications
The technology described in this patent application could be used in semiconductor manufacturing processes where precise control of wafer heating and positioning is required.
Problems Solved
This technology solves the problem of maintaining a consistent flow rate of fluid during the heating process of a wafer, ensuring uniform heating and processing.
Benefits
The benefits of this technology include improved wafer processing efficiency, higher quality output, and reduced chances of defects due to inconsistent heating.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced microchips and electronic components where precise wafer processing is crucial for product performance.
Possible Prior Art
One possible prior art for this technology could be similar wafer processing apparatus with manual flow rate adjustments, which may not provide the same level of precision and control as the automated system described in this patent application.
Unanswered Questions
== How does the flow regulator adjust the flow rate of the fluid precisely to the target flow rate? The patent application mentions a flow regulator that adjusts the flow rate of a fluid flowing into the vacuum ports to be a target flow rate. However, it does not provide details on the mechanism or technology used by the flow regulator to achieve this precise adjustment.
== What specific type of fluid is used in the wafer processing apparatus? The patent application mentions a fluid flowing into the vacuum ports to fix the wafer in place, but it does not specify the type of fluid used in the process. Understanding the nature of this fluid could provide insights into the overall operation and performance of the wafer processing apparatus.
Original Abstract Submitted
Provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.
