US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract

SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Kuan-Yu Huang of Taipei (TW)

Sung-Hui Huang of Dongshan Township (TW)

Shang-Yun Hou of Jubei City (TW)

Shu Chia Hsu of Hsinchu (TW)

Yu-Yun Huang of Hsinchu (TW)

Wen-Yao Chang of Hsinchu (TW)

Yu-Jen Cheng of Hsinchu (TW)

SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446732 titled 'SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE

Simplified Explanation

The patent application describes an interposer with multiple integrated circuit devices attached to it using conductive connectors.

• The interposer has a first side and a first integrated circuit device attached to it with a set of conductive connectors.
• The conductive connectors have different heights.
• A dummy conductive connector is placed between the interposer and the integrated circuit device.
• An underfill material is used beneath the integrated circuit device and the interposer.
• An encapsulant material is used to surround the integrated circuit device and the interposer.

Original Abstract Submitted

In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.