18314983. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD
Organization Name
Inventor(s)
Hyung Jun Choi of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18314983 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD
Simplified Explanation
The abstract describes a substrate processing apparatus that includes a stage with two regions and a plurality of pins that can adsorb a substrate using negative pressure. The first region contains a plurality of first pins that can be elevated simultaneously, while the second region contains a plurality of second pins that can also be elevated simultaneously. The first pins adsorb the substrate first, followed by the second pins.
- The substrate processing apparatus includes a stage with two regions and a plurality of pins that can adsorb a substrate using negative pressure.
- The first region of the stage contains a plurality of first pins that can be elevated at the same time.
- The second region of the stage contains a plurality of second pins that can also be elevated at the same time.
- The first pins adsorb the substrate first, and then the second pins adsorb the substrate.
Potential Applications
- Semiconductor manufacturing: This substrate processing apparatus can be used in the production of semiconductors, where precise handling and processing of substrates is crucial.
- Display panel manufacturing: The apparatus can also be applied in the production of display panels, ensuring efficient and accurate substrate processing.
Problems Solved
- Efficient substrate handling: The apparatus allows for simultaneous elevation of pins in different regions, enabling faster and more efficient substrate adsorption.
- Improved processing accuracy: By adsorbing the substrate in two stages, the apparatus ensures better stability and accuracy during processing.
Benefits
- Increased productivity: Simultaneous elevation of pins in different regions allows for faster substrate adsorption, leading to improved productivity.
- Enhanced processing accuracy: The two-stage adsorption process ensures better stability and accuracy during substrate processing, resulting in higher quality products.
Original Abstract Submitted
A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be elevated at the same time, and a plurality of second pins in the second region and are configured to be elevated at the same time. In operation, the first pins are elevated and adsorb the substrate first, and then, the second pins are elevated and adsorb the substrate.
