SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18481961 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The abstract of the patent application describes a package that consists of a die (a semiconductor device) and a redistribution structure. The die has an active surface that is covered by an encapsulant. The redistribution structure is located on the active surface of the die and positioned above the encapsulant. It includes a conductive via connected to the die, a routing pattern connected to the conductive via, and a seal ring structure. The seal ring structure comprises a first seal ring element and a second seal ring element, with the second seal ring element having a seed layer between the first and second seal ring elements. The top surface of the first seal ring element is substantially flat with the top surface of the conductive via.

The package includes a die with an active surface and an encapsulant covering it.
A redistribution structure is placed on the active surface of the die, above the encapsulant.
The redistribution structure consists of a conductive via, a routing pattern, and a seal ring structure.
The seal ring structure comprises a first seal ring element and a second seal ring element with a seed layer in between.
The top surface of the first seal ring element is flat with the top surface of the conductive via.

Potential Applications:

Semiconductor packaging industry
Electronics manufacturing

Problems Solved:

Provides a protective encapsulation for the die
Facilitates redistribution of electrical connections
Enhances the sealing and reliability of the package

Benefits:

Improved protection for the die
Efficient redistribution of electrical connections
Enhanced sealing and reliability of the package

Original Abstract Submitted

A package includes a die and a redistribution structure. The die has an active surface and is wrapped around by an encapsulant. The redistribution structure disposed on the active surface of the die and located above the encapsulant, wherein the redistribution structure comprises a conductive via connected with the die, a routing pattern located above and connected with the conductive via, and a seal ring structure, the seal ring structure includes a first seal ring element and a second seal ring element located above and connected with the first seal ring element, wherein the second seal ring element includes a seed layer sandwiched between the first seal ring element and the second seal ring element, and a top surface of the first seal ring element is substantially coplanar with a top surface of the conductive via.

18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Contents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Inventor(s)