US Patent Application 18360656. PACKAGE WITH FAN-OUT STRUCTURES simplified abstract
Contents
PACKAGE WITH FAN-OUT STRUCTURES
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shin-Puu Jeng of Po-Shan Village (TW)
Po-Hao Tsai of Taoyuan City (TW)
PACKAGE WITH FAN-OUT STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18360656 titled 'PACKAGE WITH FAN-OUT STRUCTURES
Simplified Explanation
- The patent application describes a package structure that includes a redistribution structure and a semiconductor chip bonded to it. - The package structure also includes an adhesive layer directly on the semiconductor chip. - The redistribution structure is wider than the adhesive layer. - An interposer substrate is bonded to the redistribution structure. - The bottommost surface of the interposer substrate is spaced apart from the topmost surface of the redistribution structure.
Original Abstract Submitted
A package structure is provided. The package structure includes a redistribution structure and a semiconductor chip bonded to the redistribution structure. The package structure also includes an adhesive layer directly on the semiconductor chip. The redistribution structure is wider than the adhesive layer. The package structure further includes an interposer substrate bonded to the redistribution structure. A bottommost surface of the interposer substrate is spaced apart from a topmost surface of the redistribution structure.
