18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)

METHOD OF FABRICATING DISPLAY PANEL

Organization Name

Samsung Display Co., LTD.

Inventor(s)

Jeong Won Han of Yongin-si (KR)

Won Hee Oh of Yongin-si (KR)

METHOD OF FABRICATING DISPLAY PANEL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18453190 titled 'METHOD OF FABRICATING DISPLAY PANEL

Simplified Explanation

The method described in the abstract involves fabricating a display panel by transferring and bonding light-emitting elements onto a circuit board using a transfer head.

• Transfer head picks up a transfer member from a support member.
• Light-emitting element is detached from a donor substrate by attaching the transfer member to it.
• Transfer head aligns the light-emitting element with the circuit board.
• Transfer member is detached from the transfer head.
• Light-emitting element is bonded onto the circuit board.
• Transfer head separates the transfer member from the light-emitting element on the circuit board.

Potential Applications

• Manufacturing of display panels for electronic devices.
• Production of high-resolution screens for televisions, smartphones, and other devices.

Problems Solved

• Streamlining the process of fabricating display panels.
• Ensuring precise alignment of light-emitting elements on circuit boards.

Benefits

• Improved efficiency in display panel production.
• Enhanced quality control in the manufacturing process.
• Cost-effective method for creating high-quality displays.

Original Abstract Submitted

The present disclosure may provide a method of fabricating a display panel, the method includes picking up, by a transfer head, a transfer member located on a support member, detaching a light-emitting element from a donor substrate by attaching the transfer member picked up by the transfer head to the light-emitting element on the donor substrate to lift the light-emitting element, aligning, by the transfer head, the light-emitting element attached to the transfer member on a circuit board, and detaching the transfer member from the transfer head, bonding the light-emitting element attached to the transfer member onto the circuit board and separating, by the transfer head, the transfer member from the light-emitting element bonded to the circuit board to remove the transfer member.