17887729. ADJUSTABLE WAFER CHUCK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

ADJUSTABLE WAFER CHUCK

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chia-Hsi Wang of Xihu Township (TW)

Yen-Yu Chen of Taichung City (TW)

ADJUSTABLE WAFER CHUCK - A simplified explanation of the abstract

This abstract first appeared for US patent application 17887729 titled 'ADJUSTABLE WAFER CHUCK

Simplified Explanation

- Adjustable wafer chuck designed to hold a wafer - Base portion with adjustable base structures - Pad portion with contact pads on adjustable base structures - Base structures can move in opposite directions along a plane

Potential Applications

- Semiconductor manufacturing - Wafer testing - Wafer inspection

Problems Solved

- Ensures secure holding of wafer during processing - Allows for precise positioning of wafer - Facilitates efficient wafer handling

Benefits

- Improved accuracy in wafer processing - Enhanced productivity in semiconductor industry - Versatile design for various wafer sizes

Original Abstract Submitted

Various embodiments of the present application are directed toward an adjustable wafer chuck. The adjustable wafer chuck is configured to hold a wafer. The adjustable wafer chuck comprises a base portion and a pad portion. The base portion comprises a plurality of adjustable base structures. The pad portion is disposed on a first side of the base portion. The pad portion comprises a plurality of contact pads disposed on the plurality of adjustable base structures. Each of the adjustable base structures are configured to move along a plane in a first direction and configured to move along the plane in a second direction that is opposite the first direction.