20240087940.WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
Organization Name
Inventor(s)
Myoungchul Eum of Suwon-si (KR)
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087940 titled 'WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE
Simplified Explanation
The patent application describes a wafer temporary adhesive tape with a device adhesive layer, a base layer, and a carrier adhesive layer, where the base layer contains a laser decomposable material that can be chemically decomposed by a laser beam.
- Device adhesive layer attaches to device wafer
- Base layer contains laser decomposable material
- Carrier adhesive layer attaches to carrier wafer
- Laser beam can chemically decompose base layer
Potential Applications
The technology could be used in semiconductor manufacturing processes, specifically in the handling and processing of wafers during fabrication.
Problems Solved
1. Simplifies the process of detaching wafers without damaging them 2. Enables precise and controlled decomposition of the adhesive layer
Benefits
1. Improved efficiency in wafer handling 2. Reduced risk of damage to delicate wafers 3. Enhanced precision in wafer separation
Potential Commercial Applications
Optimizing Wafer Handling in Semiconductor Manufacturing
Possible Prior Art
There are existing wafer adhesive tapes in the market, but the use of a laser decomposable material in the base layer appears to be a novel feature.
Unanswered Questions
How does the laser decomposable material affect the overall performance of the adhesive tape?
The laser decomposable material in the base layer is designed to enable controlled decomposition, but its impact on the adhesive tape's overall strength, durability, and usability remains unclear. Further testing and analysis are needed to determine the material's influence on the tape's performance.
Are there any safety concerns associated with using a laser beam to decompose the adhesive layer?
While the use of a laser beam for decomposing the adhesive layer offers precision and control, there may be potential safety hazards involved in handling the laser equipment. It is essential to assess and address any safety risks to ensure the technology's safe and effective implementation.
Original Abstract Submitted
a wafer temporary adhesive tape includes a device adhesive layer configured to be attached to a device wafer, a base layer on the device adhesive layer, and a carrier adhesive layer on the base layer and configured to be attached to a carrier wafer, wherein the base layer includes a laser decomposable material layer that can be chemically decomposed by absorbing a laser beam.
