18275548. ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME simplified abstract (LG ELECTRONICS INC.)
Contents
- 1 ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME
Organization Name
Inventor(s)
ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18275548 titled 'ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME
Simplified Explanation
The electrode structure of a transfer roller part of a semiconductor light emitting device includes a roller rotating part, an assembly substrate, an adhesive film, penetration electrodes, and roller pad electrodes.
- Roller rotating part: The main component that rotates to transfer materials in the semiconductor light emitting device.
- Assembly substrate: Mounted on the roller rotating part to provide a surface for components to be attached.
- Adhesive film: Positioned between the roller rotating part and the assembly substrate to ensure secure attachment.
- Penetration electrodes: These electrodes penetrate the assembly substrate to establish electrical connections.
- Roller pad electrodes: Located on the roller rotating part and electrically connected to the penetration electrodes.
Potential Applications
The electrode structure can be used in various semiconductor light emitting devices to facilitate efficient material transfer and electrical connections.
Problems Solved
1. Improved electrical connectivity between components in semiconductor devices. 2. Enhanced stability and reliability of transfer roller parts.
Benefits
1. Increased efficiency in material transfer processes. 2. Enhanced performance and longevity of semiconductor light emitting devices.
Potential Commercial Applications
Optimizing material transfer and electrical connections in semiconductor manufacturing processes for improved device performance.
Possible Prior Art
Prior art related to electrode structures in semiconductor devices may exist, but specific examples are not provided in this abstract.
Unanswered Questions
How does the electrode structure impact the overall efficiency of the semiconductor light emitting device?
The article does not delve into the specific quantitative improvements in efficiency resulting from the electrode structure.
Are there any potential drawbacks or limitations of using this electrode structure in semiconductor devices?
The potential drawbacks or limitations of the electrode structure, such as cost implications or manufacturing complexities, are not discussed in the abstract.
Original Abstract Submitted
Embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. Electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.
