18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Jeongseok Kim of Cheonan-si (KR)
Bongju Cho of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151517 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a redistribution structure and a vertical connection structure. The redistribution structure has a first surface with two embedded pads and a first redistribution layer. The vertical connection structure includes a land layer and a pillar layer, with the land layer embedded in the first surface of the redistribution structure. The upper surface of the land layer is narrower than the lower surface of the pillar layer.
- The semiconductor package includes a redistribution structure with embedded pads and a redistribution layer.
- It also includes a vertical connection structure with a land layer and a pillar layer.
- The land layer is embedded in the first surface of the redistribution structure.
- The upper surface of the land layer is narrower than the lower surface of the pillar layer.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics industry
Problems solved by this technology:
- Efficient redistribution of signals within a semiconductor package
- Improved vertical connection structure
Benefits of this technology:
- Enhanced signal transmission and connectivity
- Compact design for semiconductor packages
Original Abstract Submitted
A semiconductor package includes a first redistribution structure having a first surface in which a first pad and a second pad are embedded and including a first redistribution layer thereon, and a vertical connection structure including a land layer and a pillar layer. The land layer is embedded in the first surface of the first redistribution structure, and a width of an upper surface of the land layer is narrower than a width of a lower surface of the pillar layer.
