17876381. VACUUM CHUCK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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VACUUM CHUCK

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Po-Yo Su of Keelung City (TW)

Young-Wei Lin of Taoyuan City (TW)

Yu Liang Huang of Taoyuan City (TW)

Chia-Ching Lee of Taoyuan City (TW)

Chi-Chun Peng of Hsinchu County (TW)

Chen Liang Chang of New Taipei City (TW)

Kuo Hui Chang of Taoyuan County (TW)

VACUUM CHUCK - A simplified explanation of the abstract

This abstract first appeared for US patent application 17876381 titled 'VACUUM CHUCK

Simplified Explanation

The abstract describes a vacuum chuck with a moisture gate structure that allows moisture to escape, reducing warpage in a workpiece placed on the vacuum chuck. The moisture gate structure includes a base portion extending laterally from a central vacuum portion, and multiple protrusions spaced apart from the central vacuum portion and extending outward from the base portion. The end surfaces of the protrusions contact the backside surface of the workpiece when it is present on the vacuum chuck. The vacuum chuck may also include guide portions to keep the workpiece properly aligned and in position.

  • The vacuum chuck includes a moisture gate structure to reduce warpage in a workpiece.
  • The moisture gate structure has a base portion and multiple protrusions.
  • The protrusions contact the workpiece's backside surface.
  • The vacuum chuck may have guide portions to maintain proper alignment and position of the workpiece.

Potential Applications:

  • Semiconductor manufacturing: The vacuum chuck can be used to hold wafers on a carrier during various stages of semiconductor fabrication.
  • Electronics assembly: The vacuum chuck can secure delicate electronic components during assembly processes.
  • Precision machining: The vacuum chuck can hold workpieces in place during machining operations, ensuring accuracy.

Problems Solved:

  • Warpage reduction: The moisture gate structure allows moisture to escape, preventing warpage in the workpiece.
  • Alignment and positioning: The guide portions help maintain proper alignment and position of the workpiece on the vacuum chuck.

Benefits:

  • Improved product quality: By reducing warpage, the vacuum chuck helps produce higher quality workpieces.
  • Enhanced manufacturing efficiency: The vacuum chuck's ability to maintain alignment and position improves the efficiency of manufacturing processes.
  • Cost savings: Minimizing warpage reduces material waste and the need for rework or scrap.


Original Abstract Submitted

At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes a base portion that extends laterally outward from a central vacuum portion of the vacuum chuck, and a plurality of protrusions are spaced apart from the central vacuum portion and extend outward from the base portion. End surfaces of the plurality of protrusions contact a backside surface of the workpiece (e.g., a wafer on a carrier) when the workpiece is present on the vacuum chuck. The vacuum chuck may further include one or more guide portions that act as guides such that the workpiece remains properly aligned and within position when present on the vacuum chuck.