Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract

PACKAGE STRUCTURE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chia-Kuei Hsu of Hsinchu City (TW)

Ming-Chih Yew of Hsinchu City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Che-Chia Yang of Taipei City (TW)

Po-Yao Lin of Zhudong Township Hsinchu County (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096822 titled 'PACKAGE STRUCTURE

Simplified Explanation

The package structure described in the abstract includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

• First conductive pad in first insulating layer
• Conductive via in second insulating layer directly under first conductive pad
• First under bump metallurgy structure directly under conductive via
• Conductive via narrower than under bump metallurgy structure in first horizontal direction
• Under bump metallurgy structure narrower than first conductive pad

Potential Applications

The technology described in this patent application could be applied in the semiconductor industry for advanced packaging solutions, such as flip-chip packaging.

Problems Solved

This technology solves the problem of optimizing the package structure for efficient signal transmission and heat dissipation in semiconductor devices.

Benefits

The benefits of this technology include improved performance, reliability, and thermal management in semiconductor packaging.

Potential Commercial Applications

• Advanced semiconductor packaging solutions for high-performance computing
• Consumer electronics with enhanced thermal management capabilities

Possible Prior Art

Prior art may include similar package structures in semiconductor devices, but the specific configuration described in this patent application may be novel and inventive.

How does this technology compare to existing package structures in terms of performance and reliability?

This article does not provide a direct comparison with existing package structures in terms of performance and reliability. Further research and testing would be needed to evaluate the technology in relation to existing solutions.

What are the potential manufacturing challenges associated with implementing this package structure in semiconductor devices?

The article does not address potential manufacturing challenges associated with implementing this package structure in semiconductor devices. Additional information on the fabrication process and feasibility studies would be required to assess the practicality of this technology in mass production.

Original Abstract Submitted

a package structure is provided. the package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. in a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.