20240087923.CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD simplified abstract (samsung electronics co., ltd.)
Contents
- 1 CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD
Organization Name
Inventor(s)
CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087923 titled 'CHIP PICK-UP HEAD, AND CHIP DETACHMENT APPARATUS AND METHOD USING THE PICK-UP HEAD
Simplified Explanation
The chip pick-up head described in the patent application includes a collet that contacts the upper surface of a chip from a diced wafer, detaches and picks up the chip from an adhesive film. It also consists of a head part coupled to the collet, a vibration transfer rod connected to the head part to transfer vibration to the collet, and a vibration generator that generates the vibration.
- Collet in contact with chip surface
- Detaches and picks up chip from adhesive film
- Head part coupled to collet
- Vibration transfer rod transfers vibration to collet
- Vibration generator generates vibration
Potential Applications
The technology could be applied in semiconductor manufacturing processes, specifically in the handling and transfer of individual chips from wafers.
Problems Solved
The chip pick-up head streamlines the process of picking up individual chips from a wafer, reducing the risk of damage or contamination during handling.
Benefits
- Improved efficiency in chip handling - Reduced risk of damage or contamination - Precise and controlled pick-up process
Potential Commercial Applications
- Semiconductor manufacturing industry - Electronics assembly processes - Research and development labs
Possible Prior Art
One possible prior art could be vacuum-based chip pick-up tools used in semiconductor manufacturing processes.
Unanswered Questions
How does the vibration transfer rod enhance the pick-up process?
The vibration transfer rod helps in loosening the chip from the adhesive film, making it easier for the collet to pick up the chip. This mechanism could be further elaborated on to understand its specific benefits in the process.
What materials are used in the construction of the chip pick-up head?
The patent application does not specify the materials used in the construction of the chip pick-up head. Understanding the materials could provide insights into the durability and performance of the device.
Original Abstract Submitted
a chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. the chip pick-up head detaches and picks up the chip from an adhesive film. the chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration to the head part and the collet, and a vibration generator coupled to the vibration transfer rod and configured to generate the vibration.
