Samsung display co., ltd. (20240096679). SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
Organization Name
Inventor(s)
MINCHUL Song of Yongin-si (KR)
SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096679 titled 'SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
Simplified Explanation
The substrate loading device described in the patent application includes an electrostatic chuck that holds a substrate, a mask frame with a flat top surface, and multiple holders positioned between the electrostatic chuck and the mask frame. Each holder has three connection parts and can rotate between two positions over the substrate.
- Electrostatic chuck for holding the substrate
- Mask frame with a flat top surface
- Holders with three connection parts for positioning between the chuck and frame
- Rotation capability of the holders for substrate handling
Potential Applications
The technology can be used in semiconductor manufacturing processes, specifically in lithography for creating patterns on substrates.
Problems Solved
The device helps in securely holding the substrate in place during processing, preventing any misalignment or damage.
Benefits
Improved accuracy and efficiency in substrate handling Enhanced control over the manufacturing process
Potential Commercial Applications
The technology can be utilized in the production of microchips, LEDs, and other electronic components.
Possible Prior Art
Prior art may include similar substrate loading devices used in the semiconductor industry, but with different designs or functionalities.
Unanswered Questions
How does the rotation of the holders affect the substrate handling process?
The rotation of the holders allows for precise positioning and alignment of the substrate during processing, but the exact mechanism and impact on the overall process efficiency are not detailed in the abstract.
What materials are used in the construction of the electrostatic chuck and holders?
The abstract does not mention the specific materials used in the construction of the electrostatic chuck and holders, which could be crucial for understanding the durability and performance of the device.
Original Abstract Submitted
a substrate loading device includes an electrostatic chuck that chucks a substrate, a mask frame disposed under the electrostatic chuck, and including an edge having a flat top surface, and a plurality of holders disposed between the electrostatic chuck and the mask frame. each of the plurality of holders includes a first connection part connected to a side of the electrostatic chuck, a second connection part connected to the first connection part and extending in a direction intersecting an extension direction of the first connection part, and a third connection part connected to the second connection part, extending in a direction intersecting an extension direction of the second connection part, and rotationally moving between a first position overlapping the substrate in a thickness direction of the substrate and a second position spaced apart from the substrate.
