17932050. PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

VINAY Pai of Voorheesville NY (US)

Nikhil Jain of Apple Valley MN (US)

Alex Richard Hubbard of Rensselaer NY (US)

Cody J. Murray of Burnt Hills NY (US)

Richard C. Johnson of Selkirk NY (US)

PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17932050 titled 'PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS

Simplified Explanation

The semiconductor processing system described in the patent application includes a measurement tool to measure warpage characteristics in a semiconductor wafer. The system also features a pixelated surface that conforms to the warpage characteristics of the wafer and a semiconductor processing tool to perform processing on the wafer while it is retained on the pixelated surface.

  • Measurement tool to measure warpage characteristics in a semiconductor wafer
  • Pixelated surface that conforms to the warpage characteristics of the wafer
  • Semiconductor processing tool to perform processing on the wafer while it is retained on the pixelated surface

Potential Applications

This technology could be applied in the semiconductor industry for more accurate and efficient processing of wafers.

Problems Solved

This technology solves the problem of warpage in semiconductor wafers, ensuring that processing can be done accurately.

Benefits

The benefits of this technology include improved accuracy in processing semiconductor wafers and potentially higher yields in manufacturing.

Potential Commercial Applications

Optimizing Semiconductor Processing with Warpage Measurement and Conforming Surface Technology


Original Abstract Submitted

Described is a semiconductor processing system including a measurement tool configured to measure warpage characteristics in a semiconductor wafer. The semiconductor processing system further includes a pixelated surface configured to retain the semiconductor wafer, where the pixelated surface approximates the warpage characteristics to conform to the semiconductor wafer. The semiconductor processing system further includes a semiconductor processing tool configured to perform processing on the semiconductor wafer while it is retained on the pixelated surface.

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