Kioxia corporation (20240096682). PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takuro Okubo of Yokkaichi Mie (JP)
Hidekazu Hayashi of Yokkaichi Mie (JP)
PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096682 titled 'PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The processing apparatus using laser described in the abstract is designed to hold a substrate and rotate it while a laser irradiation apparatus moves in a radial direction to irradiate the substrate with an infrared pulsed laser. The control unit of the laser irradiation apparatus ensures that the distance between adjacent laser spots satisfies specific criteria in both the rotation direction and radial direction.
- Laser processing apparatus with rotating stage and radial laser irradiation
- Control unit regulates output of infrared pulsed laser for precise spot distances
- Criteria of spot distances in rotation and radial directions must be met
Potential Applications
The technology can be applied in industries such as semiconductor manufacturing, microelectronics, and materials processing for precise laser ablation, cutting, and drilling.
Problems Solved
1. Ensures accurate and consistent laser processing on substrates 2. Enables high precision and efficiency in material removal processes
Benefits
1. Improved quality and uniformity of laser processing 2. Increased productivity and cost-effectiveness in manufacturing processes
Potential Commercial Applications
Optimizing Laser Processing for Substrate Manufacturing
Possible Prior Art
Prior art may include laser processing systems with fixed laser beams and manual adjustment of spot distances, lacking the automated control of spot distances in both rotation and radial directions.
Unanswered Questions
How does the control unit precisely adjust the output of the infrared pulsed laser?
The specific mechanism or algorithm used by the control unit to regulate the laser output for spot distance control is not detailed in the abstract.
What types of substrates or materials are most suitable for this laser processing apparatus?
The abstract does not specify the compatibility of this technology with different types of substrates or materials, leaving room for further exploration and research in this area.
Original Abstract Submitted
a processing apparatus using laser according to an embodiment includes a stage configured to hold a substrate and rotate, and a laser irradiation apparatus capable of moving in a radial direction of the rotation. the laser irradiation apparatus includes a control unit configured to control an output of an infrared pulsed laser so that l1/l2 satisfies 1.2 or more and 10 or less when a distance between laser spots adjacent to each other in a rotation direction of the stage is l1 and a distance between laser spots adjacent to each other in the radial direction of the rotation is l2.
