17949258. CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF simplified abstract (Intel Corporation)
Contents
- 1 CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
Organization Name
Inventor(s)
Deniz Turan of Chandler AZ (US)
Yosef Kornbluth of Phoenix AZ (US)
Yonggang Li of Chandler AZ (US)
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17949258 titled 'CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
Simplified Explanation
The present disclosure is directed to a carrier chuck with a base plate, at least one electrode, and a dielectric layer. The electrode produces an electrostatic force to retain a panel during processing, extending at least 20 um from the top surface.
- Electrode produces electrostatic force to retain panel during processing
- Electrode extends at least 20 um from top surface
- Dielectric layer positioned over electrode
Potential Applications
The technology can be applied in industries such as semiconductor manufacturing, electronics assembly, and display panel production.
Problems Solved
1. Secure panel retention during processing 2. Enhanced efficiency in panel handling and processing
Benefits
1. Improved panel processing accuracy 2. Increased productivity in manufacturing processes 3. Reduced risk of panel damage during handling
Potential Commercial Applications
Optimizing panel processing in semiconductor manufacturing for increased efficiency and accuracy.
Possible Prior Art
Prior art may include similar carrier chuck designs with electrodes for electrostatic panel retention in manufacturing processes.
Unanswered Questions
How does the electrode height impact panel retention efficiency?
The article does not delve into the specific relationship between electrode height and panel retention effectiveness.
Are there any limitations to the dielectric layer's performance in extreme processing conditions?
The article does not address potential challenges or limitations the dielectric layer may face in harsh processing environments.
Original Abstract Submitted
The present disclosure is directed to a carrier chuck having a base plate with a top surface, at least one electrode positioned in a first carrier region of the top surface and configured to produce an electrostatic force to retain a panel placed on the carrier chuck during panel processing, and a dielectric layer positioned over the at least one electrode. The at least one electrode extends from the top surface by a height of at least 20 um.
