US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
Contents
Package and Method for Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chia-Hsiang Lin of Zhubei City (TW)
Chin-Hua Wang of New Taipei City (TW)
Package and Method for Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 17828691 titled 'Package and Method for Forming the Same
Simplified Explanation
The patent application describes a package design for a semiconductor device.
- The package includes a redistribution structure with a dielectric layer and a conductive element.
- A semiconductor device is bonded to the redistribution structure, and it has a corner.
- An underfill material is applied over the redistribution structure, and it has a protrusion that extends into the dielectric layer.
- The protrusion of the underfill material overlaps the corner of the semiconductor device in a plan view.
Original Abstract Submitted
In an embodiment, a package including: a redistribution structure including a first dielectric layer and a first conductive element disposed in the first dielectric layer; a first semiconductor device bonded to the redistribution structure, wherein the first semiconductor device includes a first corner; and an underfill disposed over the redistribution structure and including a first protrusion extending into the first dielectric layer of the redistribution structure, wherein the first protrusion of the underfill overlaps the first corner of the first semiconductor device in a plan view.
