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Category:H01L21/66
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Pages in category "H01L21/66"
The following 153 pages are in this category, out of 153 total.
1
- 17459043. Systems, Methods, and Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460097. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461688. APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17501318. INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17526774. SYSTEMS AND METHODS OF TESTING MEMORY DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17551266. IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17568176. CRITICAL DIMENSION UNIFORMITY (CDU) CONTROL METHOD AND SEMICONDUCTOR SUBSTRATE PROCESSING SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17718754. TRAY AND DESTRUCTIVE ANALYSIS AUTOMATION APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17810036. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17814997. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17832900. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17836678. METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR WAFER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17836820. METHOD FOR FABRICATING MASK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17839675. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17883250. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17887273. SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS simplified abstract (Intel Corporation)
- 17887729. ADJUSTABLE WAFER CHUCK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17895047. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895486. SPECTROSCOPIC DEVICE, SPECTROSCOPIC METHOD USING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17933968. ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME simplified abstract (Micron Technology, Inc.)
- 17943751. HEIGHT CONTROL IN NANOSHEET DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 17959892. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18062231. OVERLAY CORRECTING METHOD, AND PHOTOLITHOGRAPHY METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCANNER SYSTEM BASED ON THE OVERLAY CORRECTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18103747. SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18117848. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18118175. FABRICATING METHOD FOR TEST ELEMENT GROUP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18118775. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18133178. SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18139674. APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18150324. METHOD OF FABRICATING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18165447. MAGNETIC PROPERTY MEASURING SYSTEM, A METHOD FOR MEASURING MAGNETIC PROPERTIES, AND A METHOD FOR MANUFACTURING A MAGNETIC MEMORY DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18171286. DISPLAY DEFECT MONITORING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18181731. SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199982. PLASMA CONTROL APPARATUS AND METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18202650. METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18203163. METHOD OF CORRECTING OVERLAY, METHOD OF CONTROLLING SEMICONDUCTOR PROCESS, AND SEMICONDUCTOR PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18209286. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18213386. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213967. TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18230664. MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18237669. SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 18302401. LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18308982. SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18320046. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18331975. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18332238. MULTI-WAVELENGTH SELECTION METHOD FOR OVERLAY MEASUREMENT, AND OVERLAY MEASUREMENT METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING MULTI-WAVELENGTHS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18347817. LASER CRYSTALLIZATION MONITORING DEVICE AND METHOD OF LASER CRYSTALLIZATION MONITORING USING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18352494. BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18359031. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18366914. SEMICONDUCTOR STRUCTURE simplified abstract (MEDIATEK INC.)
- 18373098. SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING simplified abstract (Tokyo Electron Limited)
- 18380691. METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18448262. Method and device for optimizing an amount of testing with respect to a total test time simplified abstract (Robert Bosch GmbH)
- 18456261. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18462067. SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18510693. APPARATUS FOR DETECTING END POINT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513649. INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516703. SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTATIC DISCHARGE (ESD) PREVENTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18517653. FREQUENCY-PICKED METHODOLOGY FOR DIFFRACTION-BASED OVERLAY MEASUREMENT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18520369. IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM simplified abstract (Applied Materials, Inc.)
- 18526497. TSV TESTING simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
I
- Intel corporation (20240112962). DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR simplified abstract
- Intel corporation (20240113088). INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 8th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
M
R
- Robert bosch gmbh (20240136236). VERTICAL SEMICONDUCTOR COMPONENT AND METHOD FOR GENERATING AN ABRUPT END POINT DETECTION SIGNAL DURING THE PRODUCTION OF SUCH A VERTICAL SEMICONDUCTOR COMPONENT simplified abstract
- Robert Bosch GmbH patent applications on April 25th, 2024
- Robert Bosch GmbH patent applications on February 15th, 2024
S
- Samsung display co., ltd. (20240102942). DEFECT ANALYSIS DEVICE AND DEFECT ANALYSIS METHOD USING THE SAME simplified abstract
- Samsung display co., ltd. (20240107869). DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung display co., ltd. (20240118221). LASER CRYSTALLIZATION MONITORING DEVICE AND METHOD OF LASER CRYSTALLIZATION MONITORING USING THE SAME simplified abstract
- Samsung Display Co., Ltd. patent applications on April 11th, 2024
- Samsung Display Co., Ltd. patent applications on March 28th, 2024
- Samsung electronics co., ltd. (20240096714). SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096717). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096777). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240096841). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240103070). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105524). OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD simplified abstract
- Samsung electronics co., ltd. (20240118627). METHOD OF CORRECTING OVERLAY, METHOD OF CONTROLLING SEMICONDUCTOR PROCESS, AND SEMICONDUCTOR PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240128054). PLASMA CONTROL APPARATUS AND METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128135). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128236). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240134290). MULTI-WAVELENGTH SELECTION METHOD FOR OVERLAY MEASUREMENT, AND OVERLAY MEASUREMENT METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING MULTI-WAVELENGTHS simplified abstract
- Samsung electronics co., ltd. (20240136231). APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract
- Samsung electronics co., ltd. (20240136232). METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER simplified abstract
- Samsung electronics co., ltd. (20240136234). METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136237). TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240094282). CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128261). Passive Device Dies With Measurement Structures simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136174). INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Texas Instruments Incorporated patent applications on February 29th, 2024
U
- US Patent Application 17730585. AUTOMATIC OPTICAL INSPECTION SYSTEM AND METHOD simplified abstract
- US Patent Application 17824263. METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract
- US Patent Application 17824930. APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract
- US Patent Application 17826764. LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 17978645. SEMICONDUCTOR WAFER INCLUDING CHIP GUARD simplified abstract
- US Patent Application 18097924. INSPECTION METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE USING THE SAME simplified abstract
- US Patent Application 18125936. METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTERN ON A SUBSTRATE simplified abstract
- US Patent Application 18230367. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18231196. APPARATUS FOR ELECTRO-CHEMICAL PLATING simplified abstract
- US Patent Application 18231751. SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION simplified abstract
- US Patent Application 18232518. SYSTEMS AND METHODS OF TESTING MEMORY DEVICES simplified abstract
- US Patent Application 18232520. SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE simplified abstract
- US Patent Application 18249630. WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD simplified abstract
- US Patent Application 18306348. METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE simplified abstract
- US Patent Application 18341506. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18359206. MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION simplified abstract
- US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- US Patent Application 18359648. Optical Mode Optimization for Wafer Inspection simplified abstract
- US Patent Application 18361540. Controlling Fin-Thinning Through Feedback simplified abstract
- US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18446837. INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME simplified abstract
- US Patent Application 18448014. ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION simplified abstract
- US Patent Application 18448284. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract