17959892. SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Organization Name
Inventor(s)
Kwang Hyeon Jeong of Incheon (KR)
Young Joo Lee of Hwaseong-si (KR)
Young Bum Kim of Yongin-si (KR)
Hyun Mog You of Cheonan-si (KR)
Dong Joon Lee of Suwon-si (KR)
Chae Mook Lim of Yongin-si (KR)
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17959892 titled 'SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Simplified Explanation
The patent application describes a method for manufacturing semiconductor packages using a specialized apparatus. The apparatus includes a chuck, a solder device, and a scanning device. The chuck has an adsorbing portion with multiple divided regions and a driver to control each region. The method involves driving each divided region of the chuck to match the shape of the substrate based on information provided by the scanning device.
- The chuck of the semiconductor package manufacturing apparatus has a divided adsorbing portion.
- Each divided region of the chuck is capable of adsorbing the substrate.
- The driver in the chuck controls the movement of each divided region.
- The scanning device provides information about the shape of the substrate to the chuck.
- The method involves driving each divided region of the chuck to correspond to the shape of the substrate based on the information received.
Potential Applications
- Semiconductor package manufacturing industry
- Electronics manufacturing industry
Problems Solved
- Ensures proper alignment and attachment of solder balls to the substrate.
- Accommodates substrates with different shapes and sizes.
- Improves manufacturing efficiency and accuracy.
Benefits
- Enables precise and customized handling of substrates.
- Reduces the risk of misalignment or damage during the manufacturing process.
- Increases productivity and yield in semiconductor package manufacturing.
Original Abstract Submitted
A semiconductor package manufacturing method is provided. The semiconductor package manufacturing method which uses a semiconductor package manufacturing apparatus including a chuck, a solder device configured to attach solder balls to a substrate provided on the chuck, and a scanning device configured to provide information about a shape of the substrate to the chuck, wherein the chuck comprises an adsorbing portion comprising a plurality of divided regions, each of which is configured to adsorb the substrate, and a driver configured to drive each of the plurality of divided regions, the semiconductor package manufacturing method comprising driving each of the plurality of divided regions to correspond to the shape of the substrate based on the information using the driver.
